With the continuous intellectualization of electronic products, as the "hub" of the Internet, electronic products are developing in the direction of high speed, high quality and easy comprehensive management, which puts forward higher requirements for the quality of all kinds of products. However, with the increase of working frequency, working intensity and network speed, these electronic products are faced with the problem of power increase, followed by higher heat dissipation demand. As the "auxiliary material" of electronic products, thermal interface materials can help electronic products improve heat dissipation efficiency, operation speed, stability, reliability and service life, which is an indispensable part of its thermal design.

As the "medium" of the Internet, routers need to provide a strong network transmission speed, which is bound to produce huge heat. If the heat is too high, the wireless signal will be affected, such as signal instability or network outage. In addition, with the development of science and technology, routers are developing towards miniaturization, which increases the difficulty of heat dissipation. In general, the router uses passive cooling, that is, through the body cooling holes, but only relying on the cooling holes, the cooling efficiency is not high. In order to solve the problems of heat dissipation and working stability of routers, engineers usually use thermal conductive silicon film combined with the shell for heat dissipation in thermal design. When choosing thermal conductive silicone gasket, it is often necessary to determine the specification, thickness and thermal conductivity according to the heat source (such as CPU, memory, modem module).